|Name||BGA (Ball-Grid Array)|
|Pitch||0.5mm, 0.8mm, 1.0mm|
|Solderability||BGA usually requires reflow oven or infrared heater. Expert-level solderers can use the “dead-bug” prototyping method and attach super-thin wires to each ball when the package is upside down.|
The package with the densest pin density out there, BGA’s are used to either make components very small or to encompass a large number of leads. Some modern FPGA’s have more than 1700 leads! Requires an x-ray machine to discover if the balls have correctly soldered onto the pads.
A 3D render of the BGA-144 component package.
A particular BGA package may not have a complete grid of balls. BGA packages also come in a straight or staggered ball layout.
BGA Pad Diameter
The pad diameter for a BGA footprint can be determined by one of three methods:
- Maximum material condition (MMC)
- Least material condition (LMC)
- Percentage reduction of nominal ball diameter (e.g. 20%)
DSBGA (Die Sized BGA) is the name given by Texas Instruments for their family of BGA packages in where the die size is the same as the package size. They are also known by the term Wafer-Level Chip Scale Package (WLCSP). As of October 2015, they are available in 0.30, 0.35, 0.40, and 0.50mm pitches.
Texas Instruments also assigns a package code to each package within the DSBGA family. Here are some example (this is in no way an exhaustive list):
|TI Package Code||Description|
|YDC||DSBGA, 4 Leads, Pitch 0.5mm, Body 1.1×1.1mm, Height 0.4mm|
|YEA||DSBGA, 5 Leads, Pitch 0.5mm, Body 0.9×1.4mm, Height 0.5mm|
|YEB||DSBGA, 4 Leads, Pitch 0.5mm, Body 1.3×1.3mm, Height 0.625mm|
|YEC||DSBGA, 6 Leads, Pitch 0.5mm, Body 1.8×1.3mm, Height 0.625mm|
|YZP||DSBGA, 8 Leads, Pitch 0.5mm, Body 1.9×0.9mm, Height 0.5mm|
Note that confusingly, the three letter Texas Instrument’s code is not unique for a particular package. For example, the code “YZP” may refer to a 5, 6, or 8 ball DSBGA package, which also may have different height, width and length dimensions.