D2PAK (TO-263) Component Package

Overview

Name  Transistor Outline 263
Synonyms
  • TO-263 (Transistor Outline 263)
  • D2PAK (Double Decawatt package)
  • DDPAK
  • TO-263AB (TO-263-3S only)
  • TO-279 (TO-263 THIN only)
  • SMD-220 (because the TO-263 is the SMD equivalent of the TO-220).
Variants
  • TO-263-X1X2where X1 is the lead count and X2 is the length of the centre pin.
  • TO-263 THIN (a thinner variant of the standard TO-263 package by Texas Instruments)
Similar To
Mounting SMD
Pin Count 3, 5, 7, or 9 (this is X1). All packages also have a thermal pad.
Pitch
  • TO-263-3, TO-263-3S: 2.54mm
  • TO-263-7, TO-263-7S: 1.7mm
Solderability Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance

TO-263-3

  • \(T_{JA} = 18.0^{\circ}{\rm C}/W\) (1 square inch of copper surrounding pads, connected to ground)
  • \(T_{JA} = 33.6^{\circ}{\rm C}/W\) (copper filling package land-area)
  • \(T_{JA} = 36.7^{\circ}{\rm C}/W\) (pads only, no copper fill)

TO-263-5L THIN

  • \(T_{JA} = 22.0^{\circ}{\rm C}/W\) (no air flow, on JEDEX 4-layer test board)
Land Area n/a
Height
  • All except TO-263 THIN: 4.57mm
  • TO-263 THIN: 2.00mm
3D Models
Common Uses
  • High power MOSFET’s
  • High power LDO’s
  • High power SMPS (usually with integrated switching element)

The Standard Package (TO-263)

This package can be considered the SMT version of the TO-220AB. It is a 3, 5 or 7 leaded heavy-duty package that allows for good heat-sinking due to a large pad on it’s underside. Used frequently for high power MOSFETs, LDOs and SMPS. Comes with either a normal middle lead (X2 = nothing) or a short, cut-off middle lead (X2 = S).

A 3D render of the D2PAK (TO-263) component package.
A 3D render of the D2PAK (TO-263) component package.

The synonym for the TO-263 package, D2PAK, stands for “double decawatt package”. It was designed by Motorola for high power devices.

Thermal Resistance

The junction-to-ambient thermal resistance for the TO-263 component package on both standard JEDEC 2-layer and 4-layer boards is shown below:

Junction-to-ambient thermal resistance data of the TO-263 component package on both standard JEDEC 2-layer and 4-layer PCBs. Image from www.ti.com.
Junction-to-ambient thermal resistance data of the TO-263 component package on both standard JEDEC 2-layer and 4-layer PCBs. Image from www.ti.com.

TO-263 THIN

TO-263 THIN is a variant of the TO-263 component package by Texas Instruments. It shares a similar PCB footprint, but is significantly smaller in height (i.e. thinner).

A comparison in dimensions of the standard  TO-263 component package vs. the TO-263 THIN component package. Image from www.ti.com.
A comparison in dimensions of the standard TO-263 component package vs. the TO-263 THIN component package. Image from www.ti.com.

It still has a similar exposed pad on it’s underside (making it footprint compatible with the standard TO-263 package).

The exact dimensions of the TO-263 THIN package are shown in the below image:

The dimensions for the TO-263 THIN component package. Image built from elements taken from www.ti.com.
The dimensions for the TO-263 THIN component package. Image built from elements taken from www.ti.com.