TSSOP Component Package

Overview

Name TSSOP (Thin Scale Small Outline Package)
Synonyms n/a
Variants
  • Variant with pad on bottom for power ICs (e.g. half-bridges), known as HTSSOP.
Similar To n/a
Mounting SMD
Pin Count n/a
Pitch n/a
Solderability O.K. to solder by hand by experienced user. Care must be taken to avoid solder bridges between the legs of the IC.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • General IC’s
  • H-bridges (the HTSSOP variant)

Variants

There is a variant of the TSSOP with a solder pad on the underside. Texas Instruments calls this the HTSSOP package. It is used for ICs which require good thermal conductivity (e.g. half-bridges).

A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).
A 3D render of the 28-pin TSSOP component package that has a thermal pad (HTSSOP-28).

The HTTSOP-28 component package has the following thermal resistances:

Symbol Description Thermal Resistance
\( R_{\theta JA} \) Junction-to-ambient thermal resistance \(31.6^{\circ}C/W\)
\( R_{\theta JC (top)} \) Junction-to-case (top) thermal resistance \(15.9 ^{\circ}C/W\)
\( R_{\theta JC (bottom)} \) Junction-to-case (bottom) thermal resistance \(1.4^{\circ}C/W\)
\( R_{\theta JB} \)  Junction-to-board thermal resistance  \(5.6^{\circ}C/W\)

3D Renders

A 3D render of the TSSOP-38 component package.
A 3D render of the TSSOP-38 component package.